CHINA EDUCATION THINK TANK中
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名称
何为
职位
院系
材料与能源学院
研究领域

个人简介

何为，男，教授，博士生导师。享受国务院政府特殊津贴专家、四川省学术和技术带头人、四川省教书育人名师、四川省有突出贡献的优秀专家、广东省创新创业团队带头人。1990 年9 月至1992 年9 月年国家公派到意大利佛罗伦萨大学化学系做访问学者，2000 年11 月至2001 年11 月年在佛罗伦萨大学化学系做访问教授。现任四川省院士（专家）工作站遂宁英创力进站首席专家、电子薄膜与集成器件国家重点实验室珠海/遂宁分实验室主任、四川省印制电路与印制电子工程技术中心主任、中国电子电路行业协会顾问。

获得 2014 年国家科技进步二等奖1项、2018四川省科技进步一等1项、2011年教育部科技进步一等奖1项以及其他省部级科技奖 7 项。获得国家教学成果二等奖1项、四川省教学成果一等奖3项。出版专著/教材五部。 在国内外刊物发表研究论文 500 余篇（其中 SCI/EI 论文 100 余篇）。授权国家发明专利 80 余项。产学研合作成果被教育部评为 2008-2010 年度中国高校产学研合作十大优秀案例。2012年获中国产学研合作创新奖。 所率领的印制电路与印制电子科研团队，研究水平居于国内领先地位。

教育经历

暂无公开信息

科研项目

  • 电子线路与无源器件系统集成通信功能组件制造技术研究及产业, 2015-09-01-2019-04-20, 已验收, 广东省应用型科技研发专项资金项目
  • 多物理场调控电生长铜柱互连阵列及其在集成电路封装载板应用, 2019-08-20, 进展顺利, 国家自然科学基金面上项目
  • 基于多场耦合效应的多孔介质填铜协同机制研究, 2015-01-01-2019-02-25, 已验收结题, 国家自然科学基金面上项目
  • 高密度互连挠性印制电路板关键技术研发, 2018-06-06, 进展顺利, 企业横向委托技术开发项目
  • 印制电路特种电子化学品创新团队, 印制电路特种电子化学品制造技术研究及产业化, 2013-07-30-2018-11-22, 已验收（优秀）, 广东省引进第四批创新创业团队项目

论文／期刊

  1. Enhancing adhesion performance of sputtering Ti/Cu film on pretreated composite prepreg for stacking structure of IC substrates, Composites Part B: Engineering, , vol. 2019, 158, Jan 2019. 2019
  2. Copper induced direct CO2 laser drilling blind hole with the aid of brown oxidation for PCB CCL, Applied Surface Science , vol. 479 (2019), Feb 2019. 2019
  3. Competitive Adsorption between SPS and EO/PO on Copper Surface for Accelerating Trench Filling, Journal of The Electrochemical Society, , vol. 166 (2019, Feb 2019. 2019
  4. Accelerator Pre-Adsorption to Speed Up Copper Electroplating Microvia Filling, Journal of The E lectrochemical Society, , vol. 166（2019）, Feb 2019. 2019
  5. surface in-situ activation for electroless deposition of robust conductive copper patterns on polyimide film, Journal of the Taiwan Institute of Chemical Engineers , vol. 97 (2019), Apr 2019. 2019
  6. Nickel-nanoparticles-assisted direct copper-electroplating on polythiophene conductive polymers for PCB dielectric holes, Journal of the Taiwan Institute of Chemical Engineers , vol. 100 (2019), Mar 2019. 2019
  7. A novel structured spiral planar embedded inductor: Electroless-plating NiCoP alloy on copper coil as magnetic core, Journal of Magnetism and Magnetic Materials , vol. 489 (2019, May 2019. 2019
  8. A composite of epoxy resin/copper (II) acetylacetonae as catalyst of copper addition on insulated substrate, Journal of Materials Science: Materials in Electronics, , vol. 2018: 1-6, Mar 2018. 2018
  9. Enhancing adhesion performance of no-flow prepreg to form multilayer structure of printed circuit boards with plasma-induced surface modification, Surface and Coatings Technology, , vol. 2018, 333, Jan 2018. 2018
  10. Enhancing inductance of spiral copper inductor with BaFe12O19/poly (phenylene oxide) composite as an embedded magnetic core, Composites Part B: Engineering, , vol. 2018, 138, Jan 2018. 2018
  11. A comparison of typical additives for copper electroplating based on theoretical computation, Computational Materials Science, , vol. 2018, 147, Jan 2018. 2018
  12. Computational analysis and experimental evidence of two typical levelers for acid copper electroplating, Electrochimica Acta, , vol. 2018, 273, Apr 2018. 2018
  13. Effects of microstrip line fabrication and design on high-speed signal integrity transmission of PCB manufacturing process, Circuit World, , vol. 2018, 44, Apr 2018. 2018
  14. Electrochemical Factors of Levelers on Plating Uniformity of Through-Holes: Simulation and Experiments, Journal of The Electrochemical Society, , vol. 2018, 165, Jun 2018. 2018
  15. Improvement of plating uniformity for copper patterns of IC substrate with multi-physics coupling simulation., Circuit World, , vol. 2018, 44, May 2018. 2018
  16. Electric and thermal performance of poly(phenylene oxide)-based composites with synergetic modification of carbon nanotubes and nanoplatelets, Polymer Composites, , vol. 2018, 39, Feb 2018. 2018
  17. Mechanism analysis of microvia filling based on multiphysics coupling, Circuit World, , vol. 2018, 44, Jan 2018. 2018
  18. Investigation of poly (1-vinyl imidazole co 1, 4-butanediol diglycidyl ether) as a leveler for copper electroplating of through-hole, Electrochimica Acta, , vol. 2018, 283, Jun 2018. 2018
  19. Direct activation of copper electroplating on conductive composite of polythiophene surface-coated with nickel nanoparticles., Composites Part B: Engineering, , vol. 2018, 154, Aug 2018. 2018
  20. Graphene-coated copper calcium titanate to improve dielectric performance of PPO-based composite., Materials Letters, , vol. 2018, 233, Sep 2018. 2018